Thermal links/resistor assemblies (Caution to be observed when designing for use of thermal links)
Thermal links/resistor assemblies is assigned with a rated power, maximum open circuit voltage, maximum overload power, temperature derating curve and rated functioning temperature. And thermal links built in Thermal links/resistor assemblies is assigned with holding temperature and maximum temperature limit. Be sure to execute the design referring to these ratings and descriptions.
Since the Thermal links/resistor assemblies incorporates thermal links, it can operate by over-heating due to over-current or by ambient temperature rise. It may be necessary to reduce the load in accordance with the derating chart showing the relationship between the ambient temperature and permissible power so that it does not operate during normal use.
When a load is applied to the Thermal links/resistor assemblies by continuous inrush or leak current, the Thermal links/resistor assemblies may function due to the temperature rise caused by the accumulated heat storage. In this case, find the thermal equivalent power consumed by the Thermal links/resistor assemblies and use the Thermal links/resistor assemblies within the range of derating chart.
To insure that the Thermal links/resistor assemblies functions properly, it is necessary to use the Thermal links/resistor assemblies so that an electrical power of more than four times the Thermal links/resistor assemblies rated power and the less than maximum overload power is applied to the Thermal links/resistor assemblies in abnormal conditions. The Thermal links/resistor assemblies will operate more quickly and surely with greater electric power supplied. If power exceeding the maximum overload power is applied, however, the insulation resistance after the operation may be adversely affected, or the Thermal links/resistor assemblies may be damaged as the case may be. Therefore, it is advised not to allow power exceeding the maximum load power to be applied to the Thermal links/resistor assemblies in any case.
Since the Thermal links/resistor assemblies may be over-heated from external sources, do not attempt to install the Thermal links/resistor assemblies close to other heat producing components or components, which are readily affected by heat.
To check that the Thermal links/resistor assemblies can operate in accordance with its design, it is necessary to subject the trial product or initial product to normal conditions and abnormal conditions intentionally for confirmation.
