Thermal links ( Caution to be observed when designing for use of thermal links)
(1) When designing, make it sure to secure as much longer lead wires as possible, and put lead wires and body to the nearest place where heat generates in order to ensure the thermosensitive functions. When using Thermal links in equipment with winding functions such as
transformers and motors, install the Thermal links in places with good heat conductance, which will allow them to most directly sense the heat of the windings.
Design equipment so that the bodies and both lead wires of Thermal links are evenly heated.
(2) Appropriate insulation distances (clearances and creepage distances in accordance with IEC 60664-1)need to be kept between lead wires of the Thermal links and other conductive materials.
(3) When designing end products, be sure that Thermal links are not installed in locations where they would be subject to severe or continuous vibration.
(4) Design end products so that, after a Thermal links functions due to abnormal heating of the equipment, the Thermal links does not reach a temperature above its maximum temperature limit owing to overshoots.
(5) Install Thermal links so that their function is triggered only by abnormally high temperatures.
(6) Although Thermal links are highly reliable, there are limits to the abnormal states with which a single Thermal links can cope. Further, if a Thermal links is damaged for some reason, it is possible that it will not break a circuit under abnormal conditions. If there is a possibility that personal or property damage would arise if a circuit is not broken during abnormal equipment operation (i.e. when there is a high required safety level), it is effective to add one or more Thermal links with different temperature ratings.
(7) The Thermal links is attached to the part of the material with sufficient strength that the part to which the Thermal links is attached is distorted due to the load such as screwing, pushing, pulling or the like generated at the time of normal use of the final product, no load is applied to the Thermal links or the lead wire Please.
(8) The mounted Thermal links shall be adequately protected from harmful effects produced by possible spillage of liquids from the equipment, for example by covers.
(9) For sealing-in with impregnating fluids or use of cleaning solvents, investigation (trial tests) with prototypes and initial products is required to ensure that intended sealing or cleaning does not affect marking and function of the Thermal links for each individual application.